9TH Thermal and Fluids Engineering Conference (Hybrid), April, 21-24, 2024, Oregon State University, Corvallis, OR, USA
Climate change is real and electronics cooling can help. High GWP and ODP coolants were slated to handle the energy densities of future electronics, but it is imperative that we limit and/or phase out these chemicals to protect our environment for future generations. Thermal resistance is a fundamental thermodynamic irreversibility, and it is incumbent on the thermal management community to exploit new breakthroughs in manufacturing, energy systems, and chemistry to minimize these resource-robbing thermal resistances in order to be good stewards of the precious and dwindling energy sources we have here on Earth. In this talk, we will highlight the work that the Enhanced Heat Transfer Laboratory (EHTL) at Oregon State University (OSU) and others are doing on these fronts in order to effectively and efficiently design for high heat flux electronics components that are slated for the coming years. Performance augmenting features only made possible through additive manufacturing will feature prominently in the talk. Performance and design considerations of replacement coolants for the PFAS family of fluids currently under scrutiny will be discussed. While there is no single solution to this problem for any specific geographic region, there is a holistic portfolio of solutions that can be constructed from current technology that can make an impact now. Those possibilities will be highlighted throughout the work presented in this talk.
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