From idea to technology to product
Engineering Thermal Materials for Advanced Electronics Packaging
11TH Thermal and Fluids Engineering Conference (Hybrid) In person at Arizona State University, Tempe, AZ, USA And partially online virtual via Zoom and Whova
With the drive for higher performance and new functionalities, advanced electronic devices use 2.5D and 3D packaging approaches to integrate multiple electronic components within a single package. The closely integrated components often have different thermal limits – for example, memory must be maintained at much lower temperatures than processors, in order to prevent damage and degradation. Controlling heat transfer pathways within the heterogeneously integrated systems can enable high performance in all the components. This presentation focuses on two strategies for controlling heat transfer in heterogeneous packages: (1) passive thermal isolation approaches based on aerogels and (2) active thermal switching elements based on graphene and other foams. The structure and properties of these materials are engineered through a combination of experimental and computational analyses to optimize performance. Ultimately, thermally-informed design of the package can lead to higher performance and more reliable systems.
27 0